Friday, September 25, 2026

TEMPO SOFTWARE CPO HIGHLIGHTS AI SPENDING ACCOUNTABILITY AT REUTERS CONFERENCE

KUALA LUMPUR, Sept 25 (Bernama) -- Tempo Software Chief Product Officer (CPO), Kevin Nanney highlighted the growing need for enterprises to connect artificial intelligence (AI) spending with measurable business outcomes at the Reuters Momentum AI Conference in Austin, Texas.

Nanney discussed how enterprises can manage AI adoption while tracking its costs, outcomes and alignment with strategic priorities. He also shared examples from his experience at Tempo, including how competing initiatives can reveal underlying efficiency issues and how changes in measurement can help guide resource-allocation decisions.

In his keynote, titled “Spend Is Tracked. Outcomes Are Not. The AI Accountability Distance Nobody Has Closed”, Nanney outlined three areas for enterprise leaders: tracking the cost and contribution of AI agents, establishing a governed operating model for human and AI work, and adopting more adaptive planning to identify and address strategic drift.

Tempo’s 2026 State of AI in Portfolio Management report found that 91 per cent of surveyed organisations are piloting or actively using AI in project delivery, while 26 per cent use AI to prioritise or reprioritise work.

In a statement, Tempo said the findings highlight a gap between AI adoption and AI-informed decision-making, reinforcing the need to align strategy, investment and execution across human and AI workforces.

Nanney’s presentation followed Tempo’s launch of Loop, an AI-native Intelligent Portfolio Orchestration platform designed to provide enterprises with a continuously updated view of time, capacity, cost and execution across existing work systems.

The company also recently launched Workforce Intelligence, which attributes AI activity to Jira work items, epics and initiatives.

Tempo said these capabilities are designed to help enterprises coordinate human and AI work while improving visibility into portfolio execution and resource allocation.

The 2026 Reuters Momentum AI Conference, held in Austin from Sept 24 to 26, brought together enterprise leaders focused on AI implementation, business value and investment returns. More than 500 senior executives were expected to attend.

-- BERNAMA

Thursday, September 24, 2026

YEAHKA EXECUTIVE HIGHLIGHTS AI’S ROLE IN RESHAPING PAYMENTS

KUALA LUMPUR, Sept 24 (Bernama) -- Yeahka Ltd, through its international payment brand YeahPay, highlighted the growing role of artificial intelligence (AI) in reshaping payment platforms as consumer discovery, decision-making and transactions increasingly converge.

Speaking at the Platform Leaders Forum of Stripe Tour in Shanghai, YeahPay Global Vice President, David Tay said payment platforms could increasingly extend their role beyond transaction processing to areas such as merchant discoverability, customer engagement and payment acceptance.

“Value is migrating from processing the transaction to being present at the point of discovery and decision,” he said in a statement.

Yeahka has begun exploring this shift through agentic payments and commerce initiatives with industry partners, leveraging its merchant network and payments expertise to help businesses operate in an environment where transactions may increasingly be initiated by consumers and AI agents.

The initiatives aim to help merchants participate in AI-driven commerce, including making products discoverable through large language models and supporting emerging forms of payment interaction.

Yeahka is also applying AI to merchant operations through digital employees that support customer enquiries, product and service recommendations, bookings, payments, customer relationship management (CRM) and repeat purchases.

These initiatives reflect a broader effort to connect customer discovery and engagement with transactions and ongoing merchant management, creating a more integrated commerce model.

Looking ahead, Tay expects payment and technology platforms to differentiate themselves either through deeper investment in regulated capabilities that require time and regulatory approvals to build, or through specialised workflows that general-purpose platforms may not easily serve.

“As the interfaces through which consumers discover, buy and pay continue to evolve, the ability to maintain the underlying customer relationship could become an increasingly important measure of platform strength,” Tay said.

-- BERNAMA

Toshiba Launches 3300V SiC MOSFET Module with High Surge Current Capability that Helps Improve Reliability of Industrial Equipment

 


Table

Toshiba: IX800FXF2YMS4, a 3300V, 800A dual SiC MOSFET module with 300kA²s I²t capability for industrial equipment.


KAWASAKI, Japan, Sept 24 (Bernama-BUSINESS WIRE) -- Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I2t limit value in the diode section, an indicator of surge current capability.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260923706775/en/ 

Manufacturers of industrial equipment, including railway traction inverters and converters, renewable energy power generation systems, and industrial motor control equipment, must constantly meet increasing demands for higher efficiency, smaller size and improved reliability. In these systems, large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a sufficient surge current capability.

IX800FXF2YMS4 has an optimized SiC chip design and delivers an I2t characteristic of 300kA2s[1], an indicator of the diode section’s surge current capability under abnormal conditions.

The module has a drain-source on-voltage (sense) (VDS(on)sense) of 1.4V (typ.)[2], which helps reduce conduction losses. Its turn-on switching loss (Eon) of 185mJ (typ.)[3] and turn-off switching loss (Eoff) of 175mJ (typ.)[3] help reduce switching losses. These characteristics contribute to improved equipment reliability and efficiency, and to smaller cooling systems.

The new product adopts the iXPLV™ package[4], which offers excellent mounting compatibility. It uses silver sintering bonding technology to improve the heat resistance and reliability of bonded sections with SiC chips, achieving the 175°C channel temperature rating required for industrial equipment.

This new addition to Toshiba’s lineup brings the number of SiC MOSFET modules in the iXPLV™ package to four, broadening the range of available product options.

Toshiba will continue to expand its lineup of SiC MOSFET modules for industrial equipment and provide a wider range of product options that meet diverse equipment specifications and applications. The company will also contribute to more reliable, efficient and compact industrial equipment.

Notes:
[1] Test conditions: Tch(initial)=175°C, VGS=-6V, half sine-wave 10ms 1pulse, F.R.=1%
[2] Test conditions: ID=800A, VGS=+20V, Tch=25°C
[3] Test conditions: VDD=1800V, ID=800A, VGS=+20V/-6V, Cgs=100nF, RG(on)=1.2Ω, RG(off)=1.2Ω, Tch=175°C, LS≃70nH
[4] iXPLVTM: Abbreviation for intelligent fleXible Package Low Voltage

Applications

Industrial equipment
  • Railway traction inverters and converters
  • Renewable energy power generation systems
  • Power conversion systems (solid-state transformers (SST)[5]; uninterruptible power supplies (UPS); energy storage systems (ESS), etc.)
  • Industrial motor control equipment, etc.
Note:
[5] SST: A next-generation transformer that utilizes power semiconductors to achieve compact size, highly efficient voltage conversion, and advanced power control.

Features
  • Specifies I2t limit value (Diode) rating: I2t=300kA2s
  • Low drain-source on-voltage (sense): VDS(on)sense=1.4V (typ.)
  • Low switching loss: Eon=185mJ (typ.), Eoff=175mJ (typ.)
  • Channel temperature rating: Tch=175°C
  • Adopts the iXPLVTM package.

Main Specifications
(Tc=25°C, unless otherwise specified)
Part numberIX800FXF2YMS4
PackageNameiXPLV™
Size (mm)Typ.144×99.5×40
Absolute
maximum
ratings
Drain-source voltage VDSS (V)3300
Gate-source voltage VGSS (V)+25/-10
Drain current (DC) ID (A)800
Drain current (pulsed) IDP (A)1600
Channel temperature Tch (°C)175
Isolation voltage Visol
(Vrms)
AC, 60s6000
I2t limit value (Diode) I2t
(kA2s)
Tch(initial)=175°C, VGS=-6V,
half sine-wave 10ms 1pulse,
F.R.=1%
300
Electrical
characteristics
Drain-source on-voltage (sense)
VDS(on)sense (V)
ID=800A, VGS=+20V,
Tch=25°C
Typ.1.4
Source-drain on-voltage (sense)
VSD(on)sense (V)
IS=800A, VGS=+20V,
Tch=25°C
Typ.1.4
Source-drain off-voltage (sense)
VSD(off)sense (V)
IS=800A, VGS=-6V,
Tch=25°C
Typ.2.2
Stray inductance LsPN (nH)P terminal-N terminalTyp.12
Turn-on switching loss
Eon (mJ)
VDD=1800V, ID=800A,
VGS=+20V/-6V,
Cgs=100nF, RG(on)=1.2Ω,
RG(off)=1.2Ω, Tch=175°C,
LS≃70nH
Typ.185
Turn-off switching loss
Eoff (mJ)
Typ.175

Follow the link below for more on the new product.
IX800FXF2YMS4

Follow the link below for more on Toshiba’s SiC power device lineup.
SiC Power Devices

* iXPLV™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on over half a century of experience and innovation to offer customers and business partners outstanding discrete semiconductors, system LSIs and HDD products.

Its 17,400 employees around the world share a determination to maximize product value, and to promote close collaboration with customers in the co-creation of value and new markets. The company looks forward to building and to contributing to a better future for people everywhere.

Find out more at https://toshiba.semicon-storage.com/ap-en/top.html

View source version on businesswire.com:
https://www.businesswire.com/news/home/20260923706775/en/

Contact

Customer Inquiries:
Power & Small Signal Device Sales & Marketing Dept.
Tel: +81-44-548-2216
Contact Us

Media Inquiries:
C. Nagasawa
Communications & Market Intelligence Dept.
Toshiba Electronic Devices & Storage Corporation
semicon-NR-mailbox@ml.toshiba.co.jp

Source : Toshiba Electronic Devices & Storage Corporation

Thursday, September 17, 2026

JUMIO EXPANDS REUSABLE IDENTITY SOLUTION IN APAC

Jumio Extends True Reusable Identity to APAC with selfie.DONE™, Powered by Global Identity Graph


KUALA LUMPUR, Sept 17 (Bernama) -- Jumio, an artificial intelligence (AI)-powered identity intelligence provider, has launched its reusable identity solution, selfie.DONE, across the Asia-Pacific (APAC) region as part of its global rollout.

The company said the solution enables businesses to recognise enrolled users through a selfie without requiring an identity document at the start of every onboarding process, with document verification retained for users who cannot be confidently recognised or present elevated risk.

Jumio president and chief product and technology officer, Bala Kumar said the APAC launch marked a shift from point-in-time verification towards continuous identity intelligence, enabling organisations to recognise trusted users while maintaining appropriate risk and compliance controls.

In a statement, the company said deployments of selfie.DONE have recorded a 20 per cent increase in verification completion rates, with up to 60 per cent of users completing verification without submitting an identity document.

Unlike identity wallets or networks limited to affiliated businesses, Jumio said its solution uses a global identity graph containing over 75 million legitimate and fraudulent identities, which grows by approximately 85,000 identities daily.

The company said the connected identity intelligence enables businesses to recognise users previously verified elsewhere while conducting fresh risk assessments for each transaction.

Selfie.DONE is being introduced in APAC following launches in Latin America and North America. Jumio said the solution is aimed at organisations including financial services firms, gaming platforms and sharing-economy businesses.

Jumio said the APAC expansion comes as companies in the region explore more streamlined know-your-customer (KYC) processes and seek to reduce onboarding friction while meeting regulatory requirements.

Nimbura, a Malaysia-based licensed digital lender, said the technology could help improve customer conversion in digital lending while maintaining security and compliance.

-- BERNAMA

Tuesday, September 15, 2026

Space42, Viasat To Form Shared Space And Ground Infrastructure Platform

KUALA LUMPUR, Sept 14 (Bernama) -- Space42, the United Arab Emirates (UAE)-based artificial intelligence (AI)-powered SpaceTech company, and Viasat Inc have signed an agreement to formally establish Equatys, a shared space and ground infrastructure platform, with the two companies to make an initial equity contribution of up to US$1 billion. (US$1 = RM4.06)

Announced at World Space Business Week in Paris, Equatys will support the extension of mobile coverage to areas that terrestrial networks cannot serve, including coverage gaps in populated metropolitan areas.

Viasat, a global leader in satellite and secure communications, is expected to be appointed as Equatys’ prime technology contractor, according to Space42 in a statement.

Space42 and Viasat have commercial relationships with more than 400 mobile operators worldwide and access to over 100 megahertz (MHz) of globally coordinated Mobile Satellite Services (MSS) spectrum for Direct-to-Device (D2D) deployment, creating a scalable foundation for the venture.

Equatys will support the connection of smartphones, Internet of Things (IoT) devices and other devices and terminals directly to satellites, allowing mobile operators to offer voice, text and data where cellular networks are otherwise unavailable or have low density.

The agreement builds on work by Space42 and Viasat on the technical design and manufacture of the satellites, along with progress in terrestrial network integration, interoperability standards and engagement with mobile network operators and other ecosystem participants.

Built on a Tower Company model, which helped the terrestrial mobile industry scale by sharing standardised and common infrastructure among operators, Equatys will provide a neutral, shared layer of satellite and ground infrastructure.

By sharing infrastructure rather than duplicating it, ecosystem participants can reduce capital requirements, accelerate deployment, increase service availability, and maintain customer and commercial independence.

Multiple operators will be able to use the same platform while maintaining their own spectrum licensing rights, customers and commercial relationships. The model is designed to allow additional spectrum licensees and satellite operators to participate as the system scales.

-- BERNAMA

ZEISS UNVEILS HYBRID 3D X-RAY MICROSCOPE FOR MULTI-SCALE IMAGING

KUALA LUMPUR, Sept 15 (Bernama) -- ZEISS, a technology enterprise operating in the fields of optics and optoelectronics, has introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers analyse samples faster.

Combining X-ray microscopy and microCT in a single platform, the system provides multi-scale imaging, guided workflows and automated artificial intelligence (AI)-enabled reconstruction for non-destructive 3D imaging.

In a statement, ZEISS Microscopy Head of the X-ray Microscopy Field of Business, Nicolas Gueninchault said the system enables users to work more efficiently while balancing throughput, resolution and ease of use, adding that it also helps protect valuable samples while providing 3D imaging capabilities.

ZEISS VersaXRM 5 Insight combines large field-of-view and high-resolution imaging in one system, allowing users to inspect larger samples, zoom into regions of interest and capture detailed 3D images without changing hardware configurations or interrupting workflows.

The system combines the throughput, flexibility and efficiency of microCT with the detailed imaging capabilities of laboratory-based X-ray microscopy, enabling a unified workflow for imaging large-scale structures and fine internal features while preserving sample integrity.

ZEISS VersaXRM 5 Insight features Resolution at a Distance (RaaD), which enables high-resolution imaging of small features and internal defects within larger samples. The technology reduces the need to cut, trim or refixture samples, helping users save time, reduce preparation errors and protect delicate or difficult-to-reproduce specimens.

The system also features ZEN navx, an intuitive software environment with intelligent guidance and sample-aware navigation that simplifies setup, supports sample-specific imaging decisions and helps protect samples and the system.

ZEISS VersaXRM 5 Insight supports applications across materials research, industrial inspection and life sciences, including failure analysis, internal defect detection, part quality inspection and 3D visualisation of biological structures across multiple scales.

The system also supports in-situ and 4D studies in materials research, as well as root-cause analysis of semiconductor and electronic packages and yield improvement in manufacturing and quality assurance applications.

-- BERNAMA

Sunday, September 13, 2026

Alderbuck Energy Appoints Sunil Chhaya As VP Of Market Development & Applications Engineering

KUALA LUMPUR, Sept 10 (Bernama) -- Alderbuck Energy, a San Diego-based power infrastructure company, has announced the appointment of Sunil Chhaya as Vice President (VP) of Market Development & Applications Engineering.


Joining Alderbuck from the Electric Power Research Institute (EPRI), Chhaya will lead market development and applications engineering for the company’s integrated power platform, the Nexus Power Unit medium-voltage solid-state transformer and the PowerVector AI software layer.


“I joined Alderbuck because it has a team that has previously commercialised advanced hardware, and because the company understands that power electronics and the intelligence layer must be systemised together.


“It is not often a career comes full circle this precisely, and Alderbuck is exactly where I am excited to close that loop,” said Chhaya in a statement.


The appointment comes as Alderbuck moves its platform from design into the field. A planned Nexus Power Unit pilot at the San Diego Supercomputer Center at UC San Diego is meant to show how medium-voltage solid-state conversion can cut footprint, installation time and energy losses for high-density artificial intelligence (AI) loads.


The pilot is funded through a California Energy Commission initiative with San Diego Gas & Electric, EmeraldAI and the Good For Others Foundation, according to Alderbuck.


As power demand grows more intense and dynamic with AI compute, transport electrification and distributed resources, Chhaya will help position Alderbuck as a platform that treats power electronics, grid interoperability and site economics as one system.


As power demand grows more intense and dynamic with AI compute, transport electrification, and distributed resources, Chhaya will help position Alderbuck as the platform that treats power electronics, grid interoperability, and site economics as one system.


-- BERNAMA

Thursday, September 10, 2026

COMMAND ALKON TO SHOWCASE CLOUD, AI SOLUTIONS AT REGIONAL EVENTS

KUALA LUMPUR, Sept 10 (Bernama) -- Command Alkon, a software and solutions provider for the heavy building materials industry, will showcase its cloud and artificial intelligence (AI) solutions at two industry conferences in Australia and New Zealand in October.

In a statement, the company said it will participate in the 2026 IQA National Conference on the Gold Coast, Australia, from Oct 6 to 8, followed by the Concrete NZ Conference 2026 in Wellington, New Zealand, from Oct 21 to 23.

Command Alkon Vice President of Marketing, Lori Allen said the events provide an opportunity to demonstrate how production, dispatch and fleet operations can run on a connected platform, while showcasing the potential of Command Intelligence to support decision-making.

At the IQA National Conference, Command Alkon will highlight its Command Cloud platform, including Dispatch & Scale Ticketing for scheduling and ticketing, TrackIt for vehicle management, and Command Intelligence, its agentic AI offering that enables producers to query operational data and automate defined tasks.

Meanwhile, at the Concrete NZ Conference, the company will showcase Command Cloud's capabilities for concrete producers, including Batch for plant operations, Dispatch for sales, scheduling, delivery and billing, TrackIt for fleet management and Command Intelligence for AI-powered operational insights and task execution.

Command Alkon said the two events will bring together industry participants from the quarrying, concrete, building and construction sectors, providing opportunities to demonstrate its latest technology and engage with customers across the region.

-- BERNAMA

Wednesday, September 9, 2026

SMARTSHEET EXPANDS APAC, JAPAN OPERATIONS WITH NEW LEADERSHIP

KUALA LUMPUR, Sept 9 (Bernama) -- Smartsheet has expanded its operations across Asia-Pacific (APAC) and Japan with new leadership appointments, as the enterprise software company seeks to accelerate customer adoption and organisation-wide artificial intelligence (AI) transformation in the region.

Smartsheet has promoted Jarrod Kinchington to Vice President and General Manager of APAC, covering Australia, New Zealand, Southeast Asia and India, and appointed Takeshi Osawa as President of Japan.

The appointments come as Smartsheet expands its regional footprint, following the opening of offices in Sydney in 2020, Tokyo in 2023, and Singapore and India earlier this year.

“Customer demand continues to accelerate across APAC, fueling strong growth and reinforcing the region’s importance to our global strategy,” said Kinchington in a statement.

He said Smartsheet provides the visibility and governance needed to connect fragmented workflows across enterprises and scale AI responsibly, particularly amid stringent compliance requirements in the region.

Osawa brings more than 25 years of enterprise technology experience from Autodesk, SAP Fieldglass and Cloudera. Since establishing its Tokyo office, Smartsheet has grown to serve over 400 customers in Japan, with its business increasing by about 400 per cent.

Customer adoption has also accelerated across key APAC and Japan sectors, including technology, manufacturing and professional services, with the company reporting double-digit growth across its fastest-growing sectors over the past year.

Smartsheet said adoption of its Model Context Protocol (MCP) Server across the region has grown by more than 500 per cent since its launch in March 2026. Customers have also executed over 600,000 AI actions through integrations with AI tools, including Claude, Microsoft Copilot, ChatGPT and Google Cloud Gemini Enterprise.

The company said its platform is being used by organisations to centralise operations, automate processes and improve visibility, including EmberPoint, which has automated 70 per cent of its business process steps using Smartsheet, and Zalaris Consulting, which reported approximately 67 per cent productivity gains.

-- BERNAMA

IPC SYSTEMS TARGETS NET-ZERO EMISSIONS ACROSS VALUE CHAIN BY 2050

KUALA LUMPUR, Sept 9 (Bernama) -- IPC Systems Inc (IPC), a global financial communications and trading connectivity provider, announced that its greenhouse gas (GHG) emissions reduction targets have been validated by SBTi Services, confirming that they conform with the Science Based Targets initiative (SBTi) criteria, including its target to achieve net-zero emissions across its value chain by 2050.

In a statement, IPC said the validation comes as financial institutions face greater scrutiny over emissions across their value chains, with regulators, investors and clients raising expectations for climate accountability and the sustainability performance of suppliers and partners.

“Our targets go beyond our operations to cover what we buy and what we deliver. Many of our clients are working to emissions targets of their own, and they need suppliers moving at the same pace. Validation by the Science Based Targets initiative is what lets them rely on our numbers,” said IPC ESG Officer, Manuel Ibáñez.

IPC serves more than 750 financial institutions globally, including the majority of trading desks across the top 100 global banks. The company said the validation gives customers independently assessed, science-aligned data to support their own value-chain emissions accounting and sustainability goals.

IPC’s validated targets cover emissions from its operations, purchased goods and services, and the use of products it delivers to customers. Based on 2022 modelling, the targets include a 35.65 per cent reduction in absolute Scope 1 and 2 GHG emissions by 2030, alongside a 32.5 per cent reduction in Scope 3 emissions from purchased goods and services and use of sold products.

By 2050, IPC aims to reduce absolute Scope 1 and 2 emissions by 90 per cent, as well as Scope 3 emissions by 90 per cent, while achieving net-zero GHG emissions across Scopes 1, 2 and 3 throughout its value chain.

IPC said it will prioritise direct emissions reductions across its value chain, with any residual emissions permanently neutralised before reaching net-zero. Its targets are listed on the SBTi Target Dashboard.

The validation marks a milestone in IPC’s broader commitment to responsible operations and advancing its infrastructure towards a net-zero future as global trading workflows evolve.

-- BERNAMA

Saturday, September 5, 2026

​Honoring the World’s Most Exceptional Tourism Destinations: Nominations Now Open for the Second TOURISE Awards


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​Honoring the World’s Most Exceptional Tourism Destinations: No
minations Now Open for the Second TOURISE Awards
 
  • The TOURISE Awards showcase the globe's most influential destinations, highlighting the richness of culture, the power of human connection, and groundbreaking advancements in travel.
  • Six categories are open for nominations, including a new award for Best Wellness Destination, plus a flagship Best Overall Destination award selected by the jury.
  • Winners will be honored at the TOURISE Awards ceremony, held in conjunction with the TOURISE Summit in Riyadh, March 23-25, 2027.
RIYADH, Saudi Arabia, Sept 4 (Bernama-BUSINESS WIRE) -- The second cycle of the TOURISE Awards officially launched today as a continuing global benchmark celebrating premier tourism destinations. The TOURISE Awards set a new global benchmark in 2025, celebrating destinations that deliver distinctive, purpose-driven travel experiences. In 2027, TOURISE will celebrate the destinations shaping tomorrow’s tourism; that deliver value across the entire journey, align with traveler purpose, and set new global standards for how the world travels, connects, and grows. Nominations are now open to the public from 1st September to 19th November 2026.

This press release features multimedia. View the full release here:
https://www.businesswire.com/news/home/20260901221901/en/ 
 
The TOURISE Awards feature six distinct award categories: Best Arts and Culture Destination, Best Adventure Destination, Best Food and Culinary Destination, Best Shopping Destination, Best Entertainment Destination, and a new category: Best Wellness Destination. Together, the categories show the full traveler journey and the evolving ways destinations create memorable, meaningful experiences. In addition, a flagship Best Overall Destination award will recognize the destination that excels across all aspects of the traveler experience and sets a global benchmark as the most exceptional place to visit.

In line with the TOURISE ethos, the Awards recognize destinations with a strong sense of identity, measurable impact, and responsible management. Eligible destinations must have (i) a defined geographic scope (a city, region or site), (ii) a distinct identity and character that stems from culture, landscapes and attractions that shape how the destination is perceived by travelers, and finally (iii) must be backed by a tourism governing body responsible for ensuring a destination is effectively managed.

His Excellency Ahmed Al-Khateeb, Minister of Tourism for Saudi Arabia and Chairman of TOURISE said: “Recognizing excellence through the TOURISE Awards is more than a celebration, it is a decisive step toward shaping the future of global tourism. These awards shine a spotlight on premier travel destinations that are not only captivating travelers with unique experiences but are also leading with innovation, sustainability, and cultural authenticity. In a world where tourism is a powerful catalyst for economic growth, cultural exchange, and community empowerment, it is critical that we honor those destinations setting new standards of excellence and purpose.”

The TOURISE Awards will be judged by an independent jury panel comprised of a powerhouse of cross-industry trailblazers from the worlds of travel and tourism, fashion, culinary, art, retail, culture, adventure and entertainment:
  • Albert Read – Former Managing Director, Condé Nast
  • Filip Boyen – Former CEO, Forbes Travel Guide
  • Bernold Schroeder – Former CEO, Kempinski Hotels
  • Fiona Jeffery – Former Chair, World Travel Market; Former Chair, Tourism for Tomorrow
  • Michael Ellis – Former Global Director, Michelin Guides
  • Omar Samra – UN Goodwill Ambassador; Mountaineer and Polar Explorer
  • Renaud de Lesquen – Former CEO, Givenchy; Former President, Dior Americas
  • Lars Nittve – Former Founding Director, Tate Modern
  • Caroline Rush – Former CEO, British Fashion Council
  • Andrew Gibson – Former VP of Global Well Being, Accor Hotels
Albert Read, Jury Panel Chair & Category Lead said: “It is an honor to be part of the TOURISE Awards. Through the rigour of its processes and the caliber of the judging team, the TOURISE Awards have set a new benchmark in recognizing the leaders in travel. With its second awards, TOURISE has the opportunity to go further: to again recognize the year's outstanding destinations but, importantly, to also track their evolution through time, building what will become the ultimate measurements of long-term impact, progress and success in global tourism.”

Destinations are evaluated across 14 assessment criteria that includes authenticity, accessibility, safety, sustainability and visitor experience. Judges will assess what makes a destination stand out in its nominated category as well as a set of universal standards that every great destination is expected to meet.

Following a public nominations period, each category will have a shortlist of destinations, from which one winner and two distinguished finalists will be selected by the jury. The winners are honored at the TOURISE Awards ceremony, held alongside the TOURISE Summit in Riyadh on March 23, 2027. 

Have your say in who receives the TOURISE Awards for the world’s most exceptional tourism destinations by nominating the destination you think makes a difference on the awards portal https://awards.tourise.com/ by 19 November.

About TOURISE

TOURISE is the world’s premier platform for redefining and shaping the future of tourism. Powered by the Saudi Ministry of Tourism, the inaugural TOURISE Summit took place 11-13, November 2025 in Riyadh. TOURISE convened visionaries from government, business, investment, tourism and technology communities to deliver high impact initiatives and transformative deals that will reset the industry and build a tourism sector that is sustainable, equitable, and future-focused. A year-round global platform, TOURISE sets the global conversation for the travel and tourism sector and brings together leaders who share a vision to shape the traveler economy. This is where the next 50 years of tourism are shaped. 

For more information about TOURISE, visit www.TOURISE.com 

About the TOURISE Awards:

The TOURISE Awards are a global celebration of destination excellence, recognizing places that deliver travel experiences that are purposeful, unforgettable, and aligned with the evolving expectations of today’s travelers. Judged by a prestigious cross-sector jury, the Awards honor destinations across six categories - Arts & Culture, Adventure, Food & Culinary, Shopping, Entertainment and Wellness - culminating in the flagship Best Overall Destination award. Now in their second cycle, the Awards continue to spotlight innovation, sustainability, cultural preservation, and visitor impact, setting a new global standard for what makes a destination truly exceptional.

Find out more about the TOURISE Awards at TOURISE.com/awards

View source version on businesswire.com:
https://www.businesswire.com/news/home/20260901221901/en/ 

Contact 

For further details contact: media@TOURISE.com 

Source : TOURISE 

--BERNAMA 

Friday, September 4, 2026

Atos-powered agentic AI solution wins IDC AI Innovation Award

 

The Sovereign AI Agent for Engineering R&D, developed jointly by Atos and manufacturer Flender China has been recognized as the Best Agentic AI Practice, which reduced design cycles by 83%, saving approximately 2,000 engineering hours annually.


Beijing, China, Sept 4 (Bernama-GLOBE NEWSWIRE) -- Atos, a global leader of AI-powered digital transformation, today announced that a sovereign Agentic AI solution developed in collaboration with a manufacturing customer in China has been honored at the IDC China AI Innovation Awards 2026. The recognition highlights the growing role of enterprise-grade Agentic AI in driving outcome-driven innovation, operational efficiency, and business transformation across key industries.

Presented by International Data Corporation (IDC), the award recognized:
  • Sovereign AI Agent for Engineering R&D, developed jointly by Atos and manufacturer Flender, with the Best Agentic AI Practice Award.
Guo Yan Ming, IT Head, Flender China said "By applying sovereign, secure and compliant AI to complex engineering workflows, the solution accelerates knowledge reuse and decision-making, helping shorten the path from design insight to market-ready innovation while demonstrating the replicability of manufacturing agents in complex knowledge management."

Yun Rui Feng, Managing Director, Atos China said "We are honored to collaborate with forward-looking customer on their AI transformation journeys. As demand for sovereign and responsible AI continues to grow across industries, Atos remains committed to helping organizations accelerate innovation and achieve measurable outcomes at scale."

Atos developed a sovereign AI agent for Flender's engineering R&D function that combines agentic AI, retrieval-augmented generation (RAG), multimodal capabilities, and deep manufacturing domain knowledge. The solution helps engineering teams move faster from concept to market launch while delivering measurable business outcomes, including:
  • An 83% reduction in design standard document and engineering drawing interpretation time, from approximately 30 minutes to 5 minutes
  • A sixfold increase in engineering design processing capacity
  • Annual savings of approximately 2,000 engineering hours
  • Improved knowledge reuse, faster onboarding, and enhanced collaboration across engineering teams

As part of the Atos Sovereign Agentic Studio (SAS), Atos China is helping organizations turn Agentic AI ambition into business results. By combining sovereign AI principles with deep industry expertise, Atos enables enterprises to deploy trusted AI solutions that accelerate decision-making, strengthen operational resilience, and unlock new opportunities for growth.

Learn more about the Atos Sovereign Agentic Studio

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About Atos

Atos is the Atos Group brand dedicated to AI-powered, secure, end-to-end digital services. Atos designs, develops, and operates critical digital environments that drive performance, resilience and sovereignty, helping public and private organizations worldwide retain control over their data and infrastructures, while meeting regulatory requirements.

With more than 52,000 employees serving over 4,500 clients across 54 countries, Atos helps modernize core IT systems, accelerate cloud and data transformation, strengthen cybersecurity, and deliver secure digital workplace environments to support its clients, its employees and society. Atos also provides consulting and advisory services through its Atos Amplify brand.

A trusted partner in operating complex and mission-critical environments, Atos supports organizations across highly regulated and sovereign contexts.

About Atos Group

Atos Group is a global leader in digital transformation with c. 54,000 employees and annual revenue of c. €7.2 billion, operating in 54 countries under two brands - Atos for services and Eviden for products and systems. European number one in cybersecurity and a leader in cloud, Atos Group is committed to a secure and decarbonized future and provides tailored AI-powered, end-to-end solutions for all industries. Atos Group is listed on Euronext Paris. 

Press contact

Olivia YANG | olivia.yang@atos.ai | +86 133 9269 5973

Attachments
 

SOURCE: Atos International

Wednesday, September 2, 2026

ANAQUA: AI DRIVES SURGE IN SEMICONDUCTOR PATENTING

KUALA LUMPUR, Sept 2 (Bernama) -- Anaqua has unveiled key findings from its 2026 Semiconductor Industry Patent Report: AI & Innovation Trends report, revealing a market undergoing structural transformation, driven significantly by the demands of artificial intelligence (AI).

The report, an analysis of global semiconductor patent activity, found that while overall semiconductor patenting grew 78 per cent over the last five years, patents at the intersection of AI and semiconductors grew 114 per cent, nearly 40 per cent faster.

Anaqua, in a statement, said AI is increasingly defining semiconductor innovation at every level of the technology stack, across chip architecture, graphics processing units (GPUs), inference processors and custom accelerators for hyperscalers.

Using Anaqua’s AcclaimIP patent analytics platform to analyse more than 700,000 semiconductor patent filings, the report shows AI’s influence on nearly every layer of chip innovation. The data was accessed between May and June 2026.

According to the report, a closer examination of key semiconductor subcategories across the AI landscape shows that AI is driving an outsized impact on the chip market and has become a primary force behind semiconductor research and development (R&D) investment and patent filings.

The report also found that NVIDIA’s patent footprint may appear smaller relative to its market dominance because its competitive advantage lies outside hardware. NVIDIA holds 49 GPU-titled semiconductor patents, ranking seventh, and ranks 15th in inference chips.

IBM tops AI-semiconductor crossover filings with 794 and analogue AI with 389, with a footprint concentrated in frontier technologies, including quantum computing, neuromorphic chips and phase-change memory that encodes neural-network weights directly onto the chip.

China dominates AI inference patenting by a significant margin and is rising rapidly in GPUs. Chinese government-affiliated entities lead inference and accelerator filings with 5,387 over five years, far ahead of Samsung’s 1,897, spanning universities, national laboratories and state research institutes.

The report also found that hyperscalers have become silicon designers. Alphabet/Google’s tensor processing unit (TPU) and Microsoft’s Maia accelerator-related patenting appear across nearly every AI-and-semiconductor patenting intersection, reflecting a shift towards cloud giants designing custom chips for their own workloads rather than buying off the shelf.

-- BERNAMA