Thursday, October 1, 2026

Streamex CEO Henry McPhie to Embark on Asia Tour with Events in Singapore and Hong Kong

 

Meetings with Potential Partners and Investors Planned for Streamex Corp. and GLDY


WINTER PARK, Fla., Oct 2 (Bernama-GLOBE NEWSWIRE) -- Streamex Corp. (“Streamex” or the “Company”) (NASDAQ: STEX), a technology company building the future of the commodity markets through tokenization, today announced that Henry McPhie, Co-Founder and Chief Executive Officer, will travel to Asia in October to attend multiple events in Singapore and Hong Kong. During the tour, Mr. McPhie will meet with potential partners and investors for Streamex and for GLDY, the Company’s gold-backed yield-bearing tokenized security.

The Asia tour reflects Streamex’s continued focus on building relationships with institutional investors, strategic partners and market participants across one of the world’s most active regions for digital assets and commodities trading. At the World Family Office Forum | Asia in Hong Kong, Mr. McPhie will participate on a panel and in 1:1 investor meetings to discuss Streamex, the Company’s roadmap and the growing opportunity for GLDY.

Henry McPhie, Co-Founder and Chief Executive Officer of Streamex, stated:

“Asian investors have been among the most forward-looking participants in digital assets and real-world asset tokenization, and their influence on how these markets develop continues to grow. We look forward to meeting with potential investors and partners across Singapore and Hong Kong to share our vision for bringing commodities on-chain.”

Singapore Events

Digital Asset Summit Asia 2026, October 7, 2026, Marina Bay Sands, Singapore. Mr. McPhie will attend Blockworks’ institutional digital asset conference, meeting with institutions and prospective partners.

Token2049 in Singapore, October 7–8, 2026. Mr. McPhie will attend Token2049, a leading digital asset industry gathering in Asia, meeting with prospective partners and investors.

Hong Kong Events

World Family Office Forum | Asia, October 15–16, 2026, The Ritz-Carlton, Hong Kong. Mr. McPhie will speak on the panel “Digital Assets & Blockchain: The Next Chapter of Innovation” on October 15 from 4:00 to 4:40 p.m. HKT. The panel will be moderated by Gabriel Karageorgiou of XBTO and includes Zann Kwan of Revo Digital Family Office and Leo Chiu of Click Ventures. The seventh edition of this forum convenes Asia’s leading business families, single family offices and their trusted advisors, and Mr. McPhie expects to meet with family offices and prospective investors for Streamex and GLDY.

How to Schedule a Meeting

Attendance at the forum is by invitation only. Qualified family offices and other interested parties may request an invitation at asia.worldfamilyofficeforum.com or contact the organizer, Connect Group, at info@connectgroup.global.

To arrange a meeting with the Streamex team while Mr. McPhie is in Singapore or Hong Kong, contact Streamex Investor Relations at IR@streamex.com.

About Streamex Corp.

Streamex Corp. (NASDAQ: STEX) is a technology and infrastructure company focused on the tokenization and digitalization of commodity real-world assets. Streamex delivers institutional-grade solutions that bridge traditional finance and blockchain-enabled markets through secure, regulated and yield-bearing financial instruments.

For more information, visit www.streamex.com.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, including statements regarding Streamex’s business strategy, investor relations initiatives, Mr. McPhie’s planned participation in events and anticipated meetings with potential investors and partners in Asia and any resulting partnerships or investments, the market opportunity for GLDY, the development and scalability of its tokenization platform, and expectations for the tokenization of real-world assets. Such statements are often identified by words such as “will,” “expects,” “plans,” “anticipates,” “intends” and similar expressions. They are based on management’s current expectations and are subject to risks and uncertainties that could cause actual results to differ materially, including that planned events or meetings may be changed, rescheduled or canceled, that meetings may not result in any partnership, investment or other transaction, and risks related to market conditions, regulatory developments affecting tokenized securities and digital assets, and the Company’s ability to develop and scale its platform and products. Forward-looking statements speak only as of the date of this press release. Except as required by law, Streamex undertakes no obligation to update any forward-looking statement. Additional information regarding these and other risks is contained in the “Risk Factors” section of the Company’s most recent Annual Report on Form 10-K and subsequent Quarterly Reports on Form 10-Q, and in its other filings with the Securities and Exchange Commission.

Contacts
Streamex Press & Investor Relations
Laura Kiernan
Head of Investor Relations
IR@streamex.com | laura@streamex.com

Henry McPhie
Chief Executive Officer, Streamex Corp.
www.streamex.com | X.com/streamex


SOURCE: Streamex Corp.

DISCLAIMER: BERNAMA MREM are not accountable for any causes of website defacement, misuse, or illegal activities connected to cryptocurrency, blockchain, tokenisation, or bitcoin. This material should not be considered as guidance or an opinion, as it does not constitute financial or investment advice. Use this information at your own risk; we are not liable for any losses or damages caused by the republication of this article.

CompoSecure Opens New London Design Centre to Meet Growing International Demand for Premium Metal Cards


New Client Studio Just Steps from Tower Bridge Enables Issuers to Design, Test, Sample & Refine Metal Card Programs Real Time and in Person


LONDON, Oct 1 (Bernama-GLOBE NEWSWIRE) -- CompoSecure, a leader in metal payment cards, security and authentication solutions, today opened a Design Centre and office in central London. At the new facility, banks, fintechs and card program partners across Europe, the Middle East and Asia can design premium metal cards alongside CompoSecure's specialists, see finished materials and techniques up close, and move from concept to specification faster. Sessions will include strategic counsel on the five elements that contribute to an effective metal card program.

Premium metal cards have become a key differentiating tool for issuers competing for new customer acquisition, revenue growth, elevated customer experience and retention. For many international issuers, designing a successful metal card program has meant working remotely with partners often an ocean away. The London Design Centre brings that process closer.

Visitors can explore first-hand an extensive range of card designs and finishes, from colours and textures to laser engraving and embedded features. They can also work directly with CompoSecure's design, metal and engineering teams at every stage, from concept and visualisation through to specification and implementation.

"The most successful card programs come from building a vision together with our clients, and that's much easier when you're in the same room," said Ian Snadden, Chief Commercial Officer, International, at CompoSecure. "Cards are used by consumers every day; they have become the primary embodiment of the bank’s brand, so issuers need to see and feel the possibilities. In London, clients can do exactly that, with our experts beside them from the first sketch to the final product. We look forward to welcoming clients and partners from around the world."

“Monavate has collaborated closely with CompoSecure on several projects, including the iconic MetaMask metal card. We participated in design sessions in the U.S. headquarters and are looking forward to working with their experts in the London Design Centre, as we look to launch several new programs in Europe and the Middle East region,” stated Scott Lucas, Co-Founder and President, Monavate.

The Design Centre sits in a restored industrial building beside the Thames, a setting that reflects the craft and engineering behind every CompoSecure card. The opening builds on 25 years of co-creating card programs globally and marks the next step in the company's international growth.

Issuers and partners can book a design session by contacting sales@composecure.com.

About CompoSecure

CompoSecure, a GPGI business (NYSE: GPGI), is the leading manufacturer of Premium Metal Payment Cards and offers best-in-class Authentication and Digital Asset solutions. The Company’s offerings combine elegance, simplicity, and security to deliver exceptional experiences and peace of mind, enabling trust for millions of people around the globe. For more information, please visit www.CompoSecure.com and www.GetArculus.com.

Forward-Looking Statements

This press release contains forward-looking statements as defined by the Private Securities Litigation Reform Act of 1995. Forward-looking statements are not historical facts, but are statements about plans, expectations, targets, goals, and future performance, including with respect to metal cards, potential future partnerships, and the London Design Centre. Although we believe that our plans, intentions, and expectations reflected in or suggested by these forward-looking statements are reasonable, we cannot assure you that we will achieve or realize these plans, intentions, or expectations. Forward-looking statements are inherently subject to risks, uncertainties, and assumptions, including but not limited to, risks associated with our plans and strategies, including international expansion and the operation of the London Design Centre, demand from issuers and partners, anticipated benefits of metal cards, and those additional risks disclosed in our reports filed with the U.S. Securities and Exchange Commission, including in sections entitled “Risk Factors”.  Forward-looking statements may be preceded by, followed by, or include the words “may,” “will,” “should,” “expect,” “opportunity,” “intend,” “plan,” “anticipate,” “believe,” “estimate,” “predict,” “potential,” “target,” “goal,” or “continue,” or the negative of these terms or other comparable terms. Forward-looking statements should not be relied on as predictions of future events and are not guarantees of performance or results. You should not put undue reliance on these statements which speak only as of the date of this press release. We undertake no obligation to update or revise publicly any of these statements, whether as a result of new information, future events or otherwise, except as required by applicable law. 

Media Contact

Stacey Gutman
sgutman@composecure.com
+1-908-356-8733 


SOURCE: CompoSecure, Inc.

DISCLAIMER: BERNAMA MREM are not accountable for any causes of website defacement, misuse, or illegal activities connected to cryptocurrency, blockchain, tokenisation, or bitcoin. This material should not be considered as guidance or an opinion, as it does not constitute financial or investment advice. Use this information at your own risk; we are not liable for any losses or damages caused by the republication of this article.

Tuesday, September 29, 2026

PINE LABS EXTENDS TECHNOLOGY PARTNERSHIP WITH WOOLWORTHS GROUP

 

KUALA LUMPUR, Sept 29 (Bernama) -- Pine Labs has extended its technology partnership with Woolworths Group, expanding its role in powering the retailer’s gift card ecosystem through enhanced platform capabilities, deeper application programming interface (API) integrations and support for new digital stored-value experiences.

Through its Qwikcilver subsidiary, Pine Labs, a global payments technology company, powers the technology platform supporting Woolworths' gift card programmes.

The partnership will build on this foundation, with a focus on strengthening platform capabilities, enabling deeper technology integration and supporting the evolution of gift card experiences across physical and digital channels.

Pine Labs Chief Executive Officer, B Amrish Rau said the partnership with Woolworths is focused on providing technology infrastructure that can evolve alongside increasingly digital, integrated and omnichannel gift card experiences.

“We are now expanding the technology foundation with enhanced platform capabilities that can support new gift card experiences and stored-value use cases,” he said in a statement.

Pine Labs’ Qwikcilver platform supports the lifecycle of gift card products, including issuance, processing, transaction management, and omnichannel programme capabilities.

Its API-led and modular architecture is designed to help Woolworths integrate gift card capabilities with its wider commerce ecosystem and progressively add new use cases by leveraging existing technology infrastructure.

Under the engagement, Pine Labs will support Woolworths’ ongoing modernisation of gift card infrastructure through enhanced API integrations, increased scalability and stronger digital programme capabilities.

-- BERNAMA

KAIYI X7 HYBRID EXPANDS INTO GLOBAL MARKETS

KUALA LUMPUR, Sept 29 (Bernama) -- Yibin Kaiyi International Trade Co Ltd, a subsidiary of KAIYI Auto, announced the KAIYI X7 Hybrid has expanded into markets across Central Asia, Africa, South America and the Middle East since its global premiere in April 2026.

In a statement, the company said the model will be followed by the all-new X7 Plus, which is scheduled to enter global markets in 2027.

The X7 Hybrid features a digital light front fascia, with sigma-shaped daytime running lights and parametric dot-matrix elements forming its front lighting design.

The triangular grille incorporates styling inspired by the Kunlun Mountains, while the lighting system includes automatic high- and low-beam switching, delayed shutoff and multiple lighting animations.

The sports utility vehicle (SUV) measures 4,710 millimetres (mm) in length, 1,955 mm in width and 1,715 mm in height, with a 2,800 mm wheelbase. Its exterior profile is designed to manage airflow toward the rear to help reduce aerodynamic drag.

Flush power-retractable door handles also provide a 20-kilogramme ice-breaking capability for use in low temperatures, while the vehicle rides on 255/50 R20 tyres and 20-inch sport wheels.

At the rear, full-width LED taillights are integrated with an illuminated rear badge and horizontal light bar. The system provides lighting animations during locking and unlocking, while the brake and turn signals are designed to improve visibility to other road users.

The all-new X7 Plus will arrive in petrol and hybrid variants, combining a new design language and fresh styling with upgraded intelligent comfort features to offer families worldwide a broader choice of SUVs.

-- BERNAMA


Monday, September 28, 2026

VOCALBEATS.AI REINFORCES COMMITMENT TO AI INNOVATION AT FCGF 2026

KUALA LUMPUR, Sept 28 (Bernama) -- Vocalbeats.AI, a Singapore-based artificial intelligence (AI) innovation company, continued its support for the FutureChina Global Forum 2026 (FCGF 2026), reinforcing its commitment to practical AI innovation and Singapore’s AI ecosystem.

Organised by Business China, the two-day FCGF 2026 was held at the Sands Expo & Convention Centre in Singapore from Sept 24 to 25 under the theme “Strengthening Resilience, Rebuilding Trust”. The forum’s guests of honour included the country’s Deputy Prime Minister and Minister for Trade and Industry Gan Kim Yong and Senior Minister of State for Digital Development and Information and Health Tan Kiat How.

“We are pleased to support the FutureChina Global Forum and contribute to the wider discussion on how AI can be applied responsibly and translated into real-world value,” said Vocalbeats.AI Chief Executive Officer, Marco Lai Jinnan in a statement.

The forum featured a dedicated AI Track for the first time, highlighting the growing importance of AI in business and society, with discussions exploring AI deployment to improve productivity and deliver tangible business and societal value, drawing on applications ranging from enterprise software to robotics.

As AI systems become more capable and widely adopted, speakers also highlighted the importance of workforce skills, workflow redesign and viable business models, alongside safety, accountability and trust.

Vocalbeats.AI said these discussions reflect its belief that the next stage of AI development will be defined by its ability to address real-world needs and deliver tangible value to users.

The company develops AI-powered applications for productivity and communication, including Owll, an AI note-taking and productivity app, and Owll Translator, an AI-powered real-time translation app.

Vocalbeats.AI’s support for the forum forms part of its broader engagement with Singapore’s AI and technology ecosystem. Over the past year, the company has expanded its collaborations with universities, public-sector organisations and AI communities.

Its initiatives include the Vocalbeats.AI Scholarship at the National University of Singapore, the Vocalbeats.AI–Turing AI Scholarship at Nanyang Technological University, Singapore; internship opportunities for students; and AI learning workshops for children and youth in local communities.

-- BERNAMA

Saturday, September 26, 2026

​SunCar Technology Reports First Half 2026 Financial Results

Net Income of $3.4 Million Improving from a Net Loss of $5.5 Million
Adjusted EBITDA increased to $9.4 Million, up 269% YoY
Delivered 1H Revenue of $277 million, a 24% YoY increase
EV Premiums increased 31% YoY to $916 million

NEW YORK, Sept 23 (Bernama-GLOBE NEWSWIRE) -- SunCar Technology Group Inc. (the "Company" or "SunCar") (NASDAQ: SDA), an innovative leader in AI-powered auto insurance and auto services, today announced financial results for the six months ended June 30, 2026.

"SunCar had an excellent first half generating $3.4 million in net income, a substantial $8.9 million improvement from a $5.5 million net loss the first half of 2025,” said Zaichang Ye, Chairman and CEO of SunCar. “Our top-line growth of 24% demonstrated that SunCar can maintain strong revenue growth while also growing profits. Major wins for the Company in the first half including the AgBank chauffeur contract and multiple Huawei ecosystem customer wins show that the size and scope of SunCar’s contracts are increasing.

“I’m particularly pleased with the revenue growth in auto services, which grew 22% from the same period last year. SunCar’s auto services segment is benefiting from our investment in AI and the increased emphasis that our insurance customers are placing on value-added auto services. SunCar is realizing unprecedented synergies from our dual product offering of services and auto insurance. Our partners are achieving a new level of value by integrating SunCar’s AI features into their services. SunCar’s cloud with its combination of insurance and auto services gives our customers a single integrated technology platform from which they can offer a full suite of customized services.

“As always, SunCar’s partners and customers are critical to our growth. Our partnerships with leading companies such as Tesla, Xiaomi, NIO, Xpeng, Huawei, Zeekr, PICC, and Ping An differentiate SunCar and validate the unique product offering we have in the market.

”In terms of technology innovation, SunCar is leading the charge in the next phase of AI which will be vertical industry AI. We have integrated AI into most of our operations and, in cooperation with our partners, are now creating customer-specific AI-powered products. This next phase of AI will be led by companies with deep industry expertise that are leveraging AI to create AI-powered ecosystems just as SunCar is doing for auto insurance and services.” 

Friday, September 25, 2026

TEMPO SOFTWARE CPO HIGHLIGHTS AI SPENDING ACCOUNTABILITY AT REUTERS CONFERENCE

KUALA LUMPUR, Sept 25 (Bernama) -- Tempo Software Chief Product Officer (CPO), Kevin Nanney highlighted the growing need for enterprises to connect artificial intelligence (AI) spending with measurable business outcomes at the Reuters Momentum AI Conference in Austin, Texas.

Nanney discussed how enterprises can manage AI adoption while tracking its costs, outcomes and alignment with strategic priorities. He also shared examples from his experience at Tempo, including how competing initiatives can reveal underlying efficiency issues and how changes in measurement can help guide resource-allocation decisions.

In his keynote, titled “Spend Is Tracked. Outcomes Are Not. The AI Accountability Distance Nobody Has Closed”, Nanney outlined three areas for enterprise leaders: tracking the cost and contribution of AI agents, establishing a governed operating model for human and AI work, and adopting more adaptive planning to identify and address strategic drift.

Tempo’s 2026 State of AI in Portfolio Management report found that 91 per cent of surveyed organisations are piloting or actively using AI in project delivery, while 26 per cent use AI to prioritise or reprioritise work.

In a statement, Tempo said the findings highlight a gap between AI adoption and AI-informed decision-making, reinforcing the need to align strategy, investment and execution across human and AI workforces.

Nanney’s presentation followed Tempo’s launch of Loop, an AI-native Intelligent Portfolio Orchestration platform designed to provide enterprises with a continuously updated view of time, capacity, cost and execution across existing work systems.

The company also recently launched Workforce Intelligence, which attributes AI activity to Jira work items, epics and initiatives.

Tempo said these capabilities are designed to help enterprises coordinate human and AI work while improving visibility into portfolio execution and resource allocation.

The 2026 Reuters Momentum AI Conference, held in Austin from Sept 24 to 26, brought together enterprise leaders focused on AI implementation, business value and investment returns. More than 500 senior executives were expected to attend.

-- BERNAMA

SASE OpsLab Unveils Platform For SASE Infrastructure Lifecycle Management

KUALA LUMPUR, Sept 23 (Bernama) -- London-headquartered SASE OpsLab Ltd has announced its latest platform release designed to tackle long-term Secure Access Service Edge (SASE) infrastructure lifecycle management.

Moving beyond the vendor “deploy and forget" approach, the solution provides enterprise information technology (IT) teams with a scalable lifecycle-orientated platform to handle infrastructure changes and related remediation in hybrid IT environments.

“For too long, the SASE channel and vendors have focused on initial rollout, leaving enterprise IT teams with the operational burden of complex hybrid infrastructure Day-2 management.

“This new release offers the Ops lifecycle tool meant to ease SASE migrations and future evolutions,” said SASE OpsLab Chief Executive Officer, Nabil Lawrence Souli in a statement.

The SASE OpsLab Enterprise edition features vendor- and domain-agnostic change management, with its signature OpsKits designed to make infrastructure changes simple and low-risk. The platform allows IT professionals to execute complex modifications across network and security architectures without specialised, vendor-specific expertise.

The platform also introduces Self-Designed Auto-Remediation OpsKits, enabling IT professionals to build custom, automated remediation scenarios. These response scenarios can extend beyond SASE technology to orchestrate connected actions across enterprise domains, including cloud asset migrations and broader infrastructure layers.

In addition, the new release includes continuous, real-time infrastructure drift detection as part of the SASE OpsLab interface. Users can also automatically roll back to a prior infrastructure state in response to unauthorised changes.

-- BERNAMA

Thursday, September 24, 2026

YEAHKA EXECUTIVE HIGHLIGHTS AI’S ROLE IN RESHAPING PAYMENTS

KUALA LUMPUR, Sept 24 (Bernama) -- Yeahka Ltd, through its international payment brand YeahPay, highlighted the growing role of artificial intelligence (AI) in reshaping payment platforms as consumer discovery, decision-making and transactions increasingly converge.

Speaking at the Platform Leaders Forum of Stripe Tour in Shanghai, YeahPay Global Vice President, David Tay said payment platforms could increasingly extend their role beyond transaction processing to areas such as merchant discoverability, customer engagement and payment acceptance.

“Value is migrating from processing the transaction to being present at the point of discovery and decision,” he said in a statement.

Yeahka has begun exploring this shift through agentic payments and commerce initiatives with industry partners, leveraging its merchant network and payments expertise to help businesses operate in an environment where transactions may increasingly be initiated by consumers and AI agents.

The initiatives aim to help merchants participate in AI-driven commerce, including making products discoverable through large language models and supporting emerging forms of payment interaction.

Yeahka is also applying AI to merchant operations through digital employees that support customer enquiries, product and service recommendations, bookings, payments, customer relationship management (CRM) and repeat purchases.

These initiatives reflect a broader effort to connect customer discovery and engagement with transactions and ongoing merchant management, creating a more integrated commerce model.

Looking ahead, Tay expects payment and technology platforms to differentiate themselves either through deeper investment in regulated capabilities that require time and regulatory approvals to build, or through specialised workflows that general-purpose platforms may not easily serve.

“As the interfaces through which consumers discover, buy and pay continue to evolve, the ability to maintain the underlying customer relationship could become an increasingly important measure of platform strength,” Tay said.

-- BERNAMA

Digital Realty: APAC AI Investment Gathers Momentum

KUALA LUMPUR, Sept 23 (Bernama) -- Digital Realty’s 2026 Global Data Insights Survey (GDIS) has found strong artificial intelligence (AI) investment momentum across Asia Pacific (APAC), alongside significant differences in how individual markets are turning that investment into business value.

Nearly six in 10 (59 per cent) APAC respondents expect their organisations to increase AI investment by more than 25 per cent in 2026 compared with 2025, versus 55 per cent globally. More than one-third (36 per cent) have already identified repeatable, high-impact AI use cases, while a similar proportion reports measurable business outcomes from AI.

The survey, which covered 2,131 information technology (IT) decision-makers across 19 countries, found that enterprises are progressing at different stages and prioritising different requirements as they move AI into wider deployment, Digital Realty said in a statement.

In Australia, 33 per cent of organisations said they are currently realising AI return on investment (ROI), more than double the APAC average of 16 per cent. Nearly half (47 per cent) also have real-time AI in deployment, compared with 36 per cent across the region.

In Japan, compliance features prominently in AI strategy and infrastructure decisions, with 30 per cent ranking compliance with AI and data privacy regulations as the top requirement for a successful AI strategy, compared with 18 per cent across APAC. In Singapore, 50 per cent cited a lack of specialised AI infrastructure as a challenge, compared with 40 per cent regionally.

South Korean enterprises, meanwhile, emphasise reliable interconnection to support AI execution, with 24 per cent ranking it first among requirements for AI strategy success, compared with 14 per cent across APAC. Almost half (46 per cent) report integrated interconnection across key cloud and infrastructure platforms or architecture centred on dynamic, on-demand interconnection.

As enterprises increase AI investment, the survey indicates that infrastructure and data-location decisions are becoming more closely tied to how AI is deployed. Across APAC, 92 per cent of respondents tie their data-location strategy to their AI plans, while 88 per cent already follow a distributed data approach, with enterprise data, applications and workloads increasingly spread across multiple locations and environments.

However, only 22 per cent of APAC respondents describe their hybrid infrastructure as fully integrated, highlighting the challenge of connecting data, compute, clouds and partners across markets. Digital Realty said enterprises will need to make increasingly deliberate choices about where workloads and data reside and how those environments connect as AI moves further into production.

Through PlatformDIGITAL, Digital Realty provides AI-ready infrastructure and connectivity across markets, helping customers bring together the data, applications, clouds and ecosystems they need as their AI strategies evolve.

-- BERNAMA

Toshiba Launches 3300V SiC MOSFET Module with High Surge Current Capability that Helps Improve Reliability of Industrial Equipment

 


Table

Toshiba: IX800FXF2YMS4, a 3300V, 800A dual SiC MOSFET module with 300kA²s I²t capability for industrial equipment.


KAWASAKI, Japan, Sept 24 (Bernama-BUSINESS WIRE) -- Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I2t limit value in the diode section, an indicator of surge current capability.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260923706775/en/ 

Manufacturers of industrial equipment, including railway traction inverters and converters, renewable energy power generation systems, and industrial motor control equipment, must constantly meet increasing demands for higher efficiency, smaller size and improved reliability. In these systems, large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a sufficient surge current capability.

IX800FXF2YMS4 has an optimized SiC chip design and delivers an I2t characteristic of 300kA2s[1], an indicator of the diode section’s surge current capability under abnormal conditions.

The module has a drain-source on-voltage (sense) (VDS(on)sense) of 1.4V (typ.)[2], which helps reduce conduction losses. Its turn-on switching loss (Eon) of 185mJ (typ.)[3] and turn-off switching loss (Eoff) of 175mJ (typ.)[3] help reduce switching losses. These characteristics contribute to improved equipment reliability and efficiency, and to smaller cooling systems.

The new product adopts the iXPLV™ package[4], which offers excellent mounting compatibility. It uses silver sintering bonding technology to improve the heat resistance and reliability of bonded sections with SiC chips, achieving the 175°C channel temperature rating required for industrial equipment.

This new addition to Toshiba’s lineup brings the number of SiC MOSFET modules in the iXPLV™ package to four, broadening the range of available product options.

Toshiba will continue to expand its lineup of SiC MOSFET modules for industrial equipment and provide a wider range of product options that meet diverse equipment specifications and applications. The company will also contribute to more reliable, efficient and compact industrial equipment.

Notes:
[1] Test conditions: Tch(initial)=175°C, VGS=-6V, half sine-wave 10ms 1pulse, F.R.=1%
[2] Test conditions: ID=800A, VGS=+20V, Tch=25°C
[3] Test conditions: VDD=1800V, ID=800A, VGS=+20V/-6V, Cgs=100nF, RG(on)=1.2Ω, RG(off)=1.2Ω, Tch=175°C, LS≃70nH
[4] iXPLVTM: Abbreviation for intelligent fleXible Package Low Voltage

Applications

Industrial equipment
  • Railway traction inverters and converters
  • Renewable energy power generation systems
  • Power conversion systems (solid-state transformers (SST)[5]; uninterruptible power supplies (UPS); energy storage systems (ESS), etc.)
  • Industrial motor control equipment, etc.
Note:
[5] SST: A next-generation transformer that utilizes power semiconductors to achieve compact size, highly efficient voltage conversion, and advanced power control.

Features
  • Specifies I2t limit value (Diode) rating: I2t=300kA2s
  • Low drain-source on-voltage (sense): VDS(on)sense=1.4V (typ.)
  • Low switching loss: Eon=185mJ (typ.), Eoff=175mJ (typ.)
  • Channel temperature rating: Tch=175°C
  • Adopts the iXPLVTM package.

Main Specifications
(Tc=25°C, unless otherwise specified)
Part numberIX800FXF2YMS4
PackageNameiXPLV™
Size (mm)Typ.144×99.5×40
Absolute
maximum
ratings
Drain-source voltage VDSS (V)3300
Gate-source voltage VGSS (V)+25/-10
Drain current (DC) ID (A)800
Drain current (pulsed) IDP (A)1600
Channel temperature Tch (°C)175
Isolation voltage Visol
(Vrms)
AC, 60s6000
I2t limit value (Diode) I2t
(kA2s)
Tch(initial)=175°C, VGS=-6V,
half sine-wave 10ms 1pulse,
F.R.=1%
300
Electrical
characteristics
Drain-source on-voltage (sense)
VDS(on)sense (V)
ID=800A, VGS=+20V,
Tch=25°C
Typ.1.4
Source-drain on-voltage (sense)
VSD(on)sense (V)
IS=800A, VGS=+20V,
Tch=25°C
Typ.1.4
Source-drain off-voltage (sense)
VSD(off)sense (V)
IS=800A, VGS=-6V,
Tch=25°C
Typ.2.2
Stray inductance LsPN (nH)P terminal-N terminalTyp.12
Turn-on switching loss
Eon (mJ)
VDD=1800V, ID=800A,
VGS=+20V/-6V,
Cgs=100nF, RG(on)=1.2Ω,
RG(off)=1.2Ω, Tch=175°C,
LS≃70nH
Typ.185
Turn-off switching loss
Eoff (mJ)
Typ.175

Follow the link below for more on the new product.
IX800FXF2YMS4

Follow the link below for more on Toshiba’s SiC power device lineup.
SiC Power Devices

* iXPLV™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on over half a century of experience and innovation to offer customers and business partners outstanding discrete semiconductors, system LSIs and HDD products.

Its 17,400 employees around the world share a determination to maximize product value, and to promote close collaboration with customers in the co-creation of value and new markets. The company looks forward to building and to contributing to a better future for people everywhere.

Find out more at https://toshiba.semicon-storage.com/ap-en/top.html

View source version on businesswire.com:
https://www.businesswire.com/news/home/20260923706775/en/

Contact

Customer Inquiries:
Power & Small Signal Device Sales & Marketing Dept.
Tel: +81-44-548-2216
Contact Us

Media Inquiries:
C. Nagasawa
Communications & Market Intelligence Dept.
Toshiba Electronic Devices & Storage Corporation
semicon-NR-mailbox@ml.toshiba.co.jp

Source : Toshiba Electronic Devices & Storage Corporation