PINE LABS EXTENDS TECHNOLOGY PARTNERSHIP WITH WOOLWORTHS GROUP

 

KUALA LUMPUR, Sept 29 (Bernama) -- Pine Labs has extended its technology partnership with Woolworths Group, expanding its role in powering the retailer’s gift card ecosystem through enhanced platform capabilities, deeper application programming interface (API) integrations and support for new digital stored-value experiences.

Through its Qwikcilver subsidiary, Pine Labs, a global payments technology company, powers the technology platform supporting Woolworths' gift card programmes.

The partnership will build on this foundation, with a focus on strengthening platform capabilities, enabling deeper technology integration and supporting the evolution of gift card experiences across physical and digital channels.

Pine Labs Chief Executive Officer, B Amrish Rau said the partnership with Woolworths is focused on providing technology infrastructure that can evolve alongside increasingly digital, integrated and omnichannel gift card experiences.

“We are now expanding the technology foundation with enhanced platform capabilities that can support new gift card experiences and stored-value use cases,” he said in a statement.

Pine Labs’ Qwikcilver platform supports the lifecycle of gift card products, including issuance, processing, transaction management, and omnichannel programme capabilities.

Its API-led and modular architecture is designed to help Woolworths integrate gift card capabilities with its wider commerce ecosystem and progressively add new use cases by leveraging existing technology infrastructure.

Under the engagement, Pine Labs will support Woolworths’ ongoing modernisation of gift card infrastructure through enhanced API integrations, increased scalability and stronger digital programme capabilities.

-- BERNAMA

KAIYI X7 HYBRID EXPANDS INTO GLOBAL MARKETS

KUALA LUMPUR, Sept 29 (Bernama) -- Yibin Kaiyi International Trade Co Ltd, a subsidiary of KAIYI Auto, announced the KAIYI X7 Hybrid has expanded into markets across Central Asia, Africa, South America and the Middle East since its global premiere in April 2026.

In a statement, the company said the model will be followed by the all-new X7 Plus, which is scheduled to enter global markets in 2027.

The X7 Hybrid features a digital light front fascia, with sigma-shaped daytime running lights and parametric dot-matrix elements forming its front lighting design.

The triangular grille incorporates styling inspired by the Kunlun Mountains, while the lighting system includes automatic high- and low-beam switching, delayed shutoff and multiple lighting animations.

The sports utility vehicle (SUV) measures 4,710 millimetres (mm) in length, 1,955 mm in width and 1,715 mm in height, with a 2,800 mm wheelbase. Its exterior profile is designed to manage airflow toward the rear to help reduce aerodynamic drag.

Flush power-retractable door handles also provide a 20-kilogramme ice-breaking capability for use in low temperatures, while the vehicle rides on 255/50 R20 tyres and 20-inch sport wheels.

At the rear, full-width LED taillights are integrated with an illuminated rear badge and horizontal light bar. The system provides lighting animations during locking and unlocking, while the brake and turn signals are designed to improve visibility to other road users.

The all-new X7 Plus will arrive in petrol and hybrid variants, combining a new design language and fresh styling with upgraded intelligent comfort features to offer families worldwide a broader choice of SUVs.

-- BERNAMA

VOCALBEATS.AI REINFORCES COMMITMENT TO AI INNOVATION AT FCGF 2026

KUALA LUMPUR, Sept 28 (Bernama) -- Vocalbeats.AI, a Singapore-based artificial intelligence (AI) innovation company, continued its support for the FutureChina Global Forum 2026 (FCGF 2026), reinforcing its commitment to practical AI innovation and Singapore’s AI ecosystem.

Organised by Business China, the two-day FCGF 2026 was held at the Sands Expo & Convention Centre in Singapore from Sept 24 to 25 under the theme “Strengthening Resilience, Rebuilding Trust”. The forum’s guests of honour included the country’s Deputy Prime Minister and Minister for Trade and Industry Gan Kim Yong and Senior Minister of State for Digital Development and Information and Health Tan Kiat How.

“We are pleased to support the FutureChina Global Forum and contribute to the wider discussion on how AI can be applied responsibly and translated into real-world value,” said Vocalbeats.AI Chief Executive Officer, Marco Lai Jinnan in a statement.

The forum featured a dedicated AI Track for the first time, highlighting the growing importance of AI in business and society, with discussions exploring AI deployment to improve productivity and deliver tangible business and societal value, drawing on applications ranging from enterprise software to robotics.

As AI systems become more capable and widely adopted, speakers also highlighted the importance of workforce skills, workflow redesign and viable business models, alongside safety, accountability and trust.

Vocalbeats.AI said these discussions reflect its belief that the next stage of AI development will be defined by its ability to address real-world needs and deliver tangible value to users.

The company develops AI-powered applications for productivity and communication, including Owll, an AI note-taking and productivity app, and Owll Translator, an AI-powered real-time translation app.

Vocalbeats.AI’s support for the forum forms part of its broader engagement with Singapore’s AI and technology ecosystem. Over the past year, the company has expanded its collaborations with universities, public-sector organisations and AI communities.

Its initiatives include the Vocalbeats.AI Scholarship at the National University of Singapore, the Vocalbeats.AI–Turing AI Scholarship at Nanyang Technological University, Singapore; internship opportunities for students; and AI learning workshops for children and youth in local communities.

-- BERNAMA

TEMPO SOFTWARE CPO HIGHLIGHTS AI SPENDING ACCOUNTABILITY AT REUTERS CONFERENCE

KUALA LUMPUR, Sept 25 (Bernama) -- Tempo Software Chief Product Officer (CPO), Kevin Nanney highlighted the growing need for enterprises to connect artificial intelligence (AI) spending with measurable business outcomes at the Reuters Momentum AI Conference in Austin, Texas.

Nanney discussed how enterprises can manage AI adoption while tracking its costs, outcomes and alignment with strategic priorities. He also shared examples from his experience at Tempo, including how competing initiatives can reveal underlying efficiency issues and how changes in measurement can help guide resource-allocation decisions.

In his keynote, titled “Spend Is Tracked. Outcomes Are Not. The AI Accountability Distance Nobody Has Closed”, Nanney outlined three areas for enterprise leaders: tracking the cost and contribution of AI agents, establishing a governed operating model for human and AI work, and adopting more adaptive planning to identify and address strategic drift.

Tempo’s 2026 State of AI in Portfolio Management report found that 91 per cent of surveyed organisations are piloting or actively using AI in project delivery, while 26 per cent use AI to prioritise or reprioritise work.

In a statement, Tempo said the findings highlight a gap between AI adoption and AI-informed decision-making, reinforcing the need to align strategy, investment and execution across human and AI workforces.

Nanney’s presentation followed Tempo’s launch of Loop, an AI-native Intelligent Portfolio Orchestration platform designed to provide enterprises with a continuously updated view of time, capacity, cost and execution across existing work systems.

The company also recently launched Workforce Intelligence, which attributes AI activity to Jira work items, epics and initiatives.

Tempo said these capabilities are designed to help enterprises coordinate human and AI work while improving visibility into portfolio execution and resource allocation.

The 2026 Reuters Momentum AI Conference, held in Austin from Sept 24 to 26, brought together enterprise leaders focused on AI implementation, business value and investment returns. More than 500 senior executives were expected to attend.

-- BERNAMA

SASE OpsLab Unveils Platform For SASE Infrastructure Lifecycle Management

KUALA LUMPUR, Sept 23 (Bernama) -- London-headquartered SASE OpsLab Ltd has announced its latest platform release designed to tackle long-term Secure Access Service Edge (SASE) infrastructure lifecycle management.

Moving beyond the vendor “deploy and forget" approach, the solution provides enterprise information technology (IT) teams with a scalable lifecycle-orientated platform to handle infrastructure changes and related remediation in hybrid IT environments.

“For too long, the SASE channel and vendors have focused on initial rollout, leaving enterprise IT teams with the operational burden of complex hybrid infrastructure Day-2 management.

“This new release offers the Ops lifecycle tool meant to ease SASE migrations and future evolutions,” said SASE OpsLab Chief Executive Officer, Nabil Lawrence Souli in a statement.

The SASE OpsLab Enterprise edition features vendor- and domain-agnostic change management, with its signature OpsKits designed to make infrastructure changes simple and low-risk. The platform allows IT professionals to execute complex modifications across network and security architectures without specialised, vendor-specific expertise.

The platform also introduces Self-Designed Auto-Remediation OpsKits, enabling IT professionals to build custom, automated remediation scenarios. These response scenarios can extend beyond SASE technology to orchestrate connected actions across enterprise domains, including cloud asset migrations and broader infrastructure layers.

In addition, the new release includes continuous, real-time infrastructure drift detection as part of the SASE OpsLab interface. Users can also automatically roll back to a prior infrastructure state in response to unauthorised changes.

-- BERNAMA

YEAHKA EXECUTIVE HIGHLIGHTS AI’S ROLE IN RESHAPING PAYMENTS

KUALA LUMPUR, Sept 24 (Bernama) -- Yeahka Ltd, through its international payment brand YeahPay, highlighted the growing role of artificial intelligence (AI) in reshaping payment platforms as consumer discovery, decision-making and transactions increasingly converge.

Speaking at the Platform Leaders Forum of Stripe Tour in Shanghai, YeahPay Global Vice President, David Tay said payment platforms could increasingly extend their role beyond transaction processing to areas such as merchant discoverability, customer engagement and payment acceptance.

“Value is migrating from processing the transaction to being present at the point of discovery and decision,” he said in a statement.

Yeahka has begun exploring this shift through agentic payments and commerce initiatives with industry partners, leveraging its merchant network and payments expertise to help businesses operate in an environment where transactions may increasingly be initiated by consumers and AI agents.

The initiatives aim to help merchants participate in AI-driven commerce, including making products discoverable through large language models and supporting emerging forms of payment interaction.

Yeahka is also applying AI to merchant operations through digital employees that support customer enquiries, product and service recommendations, bookings, payments, customer relationship management (CRM) and repeat purchases.

These initiatives reflect a broader effort to connect customer discovery and engagement with transactions and ongoing merchant management, creating a more integrated commerce model.

Looking ahead, Tay expects payment and technology platforms to differentiate themselves either through deeper investment in regulated capabilities that require time and regulatory approvals to build, or through specialised workflows that general-purpose platforms may not easily serve.

“As the interfaces through which consumers discover, buy and pay continue to evolve, the ability to maintain the underlying customer relationship could become an increasingly important measure of platform strength,” Tay said.

-- BERNAMA

Toshiba Launches 3300V SiC MOSFET Module with High Surge Current Capability that Helps Improve Reliability of Industrial Equipment

 

^{Toshiba: IX800FXF2YMS4, a 3300V, 800A dual SiC MOSFET module with 300kA²s I²t capability for industrial equipment.}


KAWASAKI, Japan, Sept 24 (Bernama-BUSINESS WIRE) -- Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I²t limit value in the diode section, an indicator of surge current capability.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260923706775/en/ 

Manufacturers of industrial equipment, including railway traction inverters and converters, renewable energy power generation systems, and industrial motor control equipment, must constantly meet increasing demands for higher efficiency, smaller size and improved reliability. In these systems, large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a sufficient surge current capability.

IX800FXF2YMS4 has an optimized SiC chip design and delivers an I²t characteristic of 300kA²s^[1], an indicator of the diode section’s surge current capability under abnormal conditions.

The module has a drain-source on-voltage (sense) (V_DS(on)sense) of 1.4V (typ.)^[2], which helps reduce conduction losses. Its turn-on switching loss (E_on) of 185mJ (typ.)^[3] and turn-off switching loss (E_off) of 175mJ (typ.)^[3] help reduce switching losses. These characteristics contribute to improved equipment reliability and efficiency, and to smaller cooling systems.

The new product adopts the iXPLV™ package^[4], which offers excellent mounting compatibility. It uses silver sintering bonding technology to improve the heat resistance and reliability of bonded sections with SiC chips, achieving the 175°C channel temperature rating required for industrial equipment.

This new addition to Toshiba’s lineup brings the number of SiC MOSFET modules in the iXPLV™ package to four, broadening the range of available product options.

Toshiba will continue to expand its lineup of SiC MOSFET modules for industrial equipment and provide a wider range of product options that meet diverse equipment specifications and applications. The company will also contribute to more reliable, efficient and compact industrial equipment.

Notes:
[1] Test conditions: T_ch(initial)=175°C, V_GS=-6V, half sine-wave 10ms 1pulse, F.R.=1%
[2] Test conditions: I_D=800A, V_GS=+20V, T_ch=25°C
[3] Test conditions: V_DD=1800V, I_D=800A, V_GS=+20V/-6V, C_gs=100nF, R_G(on)=1.2Ω, R_G(off)=1.2Ω, T_ch=175°C, L_S≃70nH
[4] iXPLV^TM: Abbreviation for intelligent fleXible Package Low Voltage

Applications

Industrial equipment

• Railway traction inverters and converters
• Renewable energy power generation systems
• Power conversion systems (solid-state transformers (SST)^[5]; uninterruptible power supplies (UPS); energy storage systems (ESS), etc.)
• Industrial motor control equipment, etc.

Note:
[5] SST: A next-generation transformer that utilizes power semiconductors to achieve compact size, highly efficient voltage conversion, and advanced power control.

Features

• Specifies I2t limit value (Diode) rating: I²t=300kA²s
• Low drain-source on-voltage (sense): V_DS(on)sense=1.4V (typ.)
• Low switching loss: E_on=185mJ (typ.), E_off=175mJ (typ.)
• Channel temperature rating: T_ch=175°C
• Adopts the iXPLV^TM package.

Main Specifications

(Tc=25°C, unless otherwise specified)
Part number				IX800FXF2YMS4
Package		Name		iXPLV™
		Size (mm)	Typ.	144×99.5×40
Absolute maximum ratings	Drain-source voltage VDSS (V)			3300
	Gate-source voltage VGSS (V)			+25/-10
	Drain current (DC) ID (A)			800
	Drain current (pulsed) IDP (A)			1600
	Channel temperature Tch (°C)			175
	Isolation voltage Visol (Vrms)	AC, 60s		6000
	I2t limit value (Diode) I2t (kA2s)	Tch(initial)=175°C, VGS=-6V, half sine-wave 10ms 1pulse, F.R.=1%		300
Electrical characteristics	Drain-source on-voltage (sense) VDS(on)sense (V)	ID=800A, VGS=+20V, Tch=25°C	Typ.	1.4
	Source-drain on-voltage (sense) VSD(on)sense (V)	IS=800A, VGS=+20V, Tch=25°C	Typ.	1.4
	Source-drain off-voltage (sense) VSD(off)sense (V)	IS=800A, VGS=-6V, Tch=25°C	Typ.	2.2
	Stray inductance LsPN (nH)	P terminal-N terminal	Typ.	12
	Turn-on switching loss Eon (mJ)	VDD=1800V, ID=800A, VGS=+20V/-6V, Cgs=100nF, RG(on)=1.2Ω, RG(off)=1.2Ω, Tch=175°C, LS≃70nH	Typ.	185
	Turn-off switching loss Eoff (mJ)		Typ.	175

Follow the link below for more on the new product.
IX800FXF2YMS4

Follow the link below for more on Toshiba’s SiC power device lineup.
SiC Power Devices

* iXPLV™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on over half a century of experience and innovation to offer customers and business partners outstanding discrete semiconductors, system LSIs and HDD products.

Its 17,400 employees around the world share a determination to maximize product value, and to promote close collaboration with customers in the co-creation of value and new markets. The company looks forward to building and to contributing to a better future for people everywhere.

Find out more at https://toshiba.semicon-storage.com/ap-en/top.html

View source version on businesswire.com:
https://www.businesswire.com/news/home/20260923706775/en/

Contact

Customer Inquiries:
Power & Small Signal Device Sales & Marketing Dept.
Tel: +81-44-548-2216
Contact Us

Media Inquiries:
C. Nagasawa
Communications & Market Intelligence Dept.
Toshiba Electronic Devices & Storage Corporation
semicon-NR-mailbox@ml.toshiba.co.jp

Source : Toshiba Electronic Devices & Storage Corporation

Mavenir Launches AI-Native NetAIShield For Telecom Fraud Protection

KUALA LUMPUR, Sept 18 (Bernama) -- Mavenir, the software company building cloud-native, artificial intelligence (AI)-by-design mobile networks, has launched NetAIShield, its next-generation AI-native fraud protection framework designed to protect telecom networks and subscribers against increasingly sophisticated fraud.

Mavenir said in a statement that NetAIShield comes with a multi-layered AI defence architecture built to correlate network telemetry, subscriber behaviour, signalling events, messaging intelligence and threat indicators into a unified, real-time view of fraud.

Designed to work alongside Mavenir's existing security portfolio or as an overlay for third-party fraud detection solutions, NetAIShield enables operators to detect, prioritise, and neutralise sophisticated attacks, including those utilising SIM farms and Application Farms, with minimal disruption to existing infrastructure.

NetAIShield’s key innovation is AI-Protected Communications, which extends fraud protection beyond the network to individual subscribers. While network-layer security protects the population by identifying and blocking fraudulent traffic before calls are connected, the most damaging scams increasingly occur during live conversations.

AI-Protected Communications addresses this challenge with a personal AI assistant that can intelligently screen unknown callers and monitor conversations for indicators of social engineering, deepfake voice impersonation, financial fraud, and other suspicious behaviour.

Operating transparently on existing devices without requiring new hardware, the capability works on a consent basis and supports regulatory compliance by informing callers that they are interacting with an AI screening assistant.

For ongoing protection, the AI assistant can remain on the call, providing real-time risk assessment, warning subscribers through whisper warnings, or helping terminate or redirect fraudulent conversations when necessary.

Mavenir added that the platform continuously learns from emerging attack patterns, enabling protection that evolves as fraud tactics change.

Built on Mavenir's proven security portfolio, which is deployed across more than 70 Tier-1 operator networks protecting over one billion subscribers worldwide, NetAIShield in combination with SpamShield, CallShield and LinkShield enables mobile operators to create a safe mobile experience for messaging, calling and browsing.

-- BERNAMA

JUMIO EXPANDS REUSABLE IDENTITY SOLUTION IN APAC

Jumio Extends True Reusable Identity to APAC with selfie.DONE™, Powered by Global Identity Graph

KUALA LUMPUR, Sept 17 (Bernama) -- Jumio, an artificial intelligence (AI)-powered identity intelligence provider, has launched its reusable identity solution, selfie.DONE, across the Asia-Pacific (APAC) region as part of its global rollout.

The company said the solution enables businesses to recognise enrolled users through a selfie without requiring an identity document at the start of every onboarding process, with document verification retained for users who cannot be confidently recognised or present elevated risk.

Jumio president and chief product and technology officer, Bala Kumar said the APAC launch marked a shift from point-in-time verification towards continuous identity intelligence, enabling organisations to recognise trusted users while maintaining appropriate risk and compliance controls.

In a statement, the company said deployments of selfie.DONE have recorded a 20 per cent increase in verification completion rates, with up to 60 per cent of users completing verification without submitting an identity document.

Unlike identity wallets or networks limited to affiliated businesses, Jumio said its solution uses a global identity graph containing over 75 million legitimate and fraudulent identities, which grows by approximately 85,000 identities daily.

The company said the connected identity intelligence enables businesses to recognise users previously verified elsewhere while conducting fresh risk assessments for each transaction.

Selfie.DONE is being introduced in APAC following launches in Latin America and North America. Jumio said the solution is aimed at organisations including financial services firms, gaming platforms and sharing-economy businesses.

Jumio said the APAC expansion comes as companies in the region explore more streamlined know-your-customer (KYC) processes and seek to reduce onboarding friction while meeting regulatory requirements.

Nimbura, a Malaysia-based licensed digital lender, said the technology could help improve customer conversion in digital lending while maintaining security and compliance.

-- BERNAMA

Space42, Viasat To Form Shared Space And Ground Infrastructure Platform

KUALA LUMPUR, Sept 14 (Bernama) -- Space42, the United Arab Emirates (UAE)-based artificial intelligence (AI)-powered SpaceTech company, and Viasat Inc have signed an agreement to formally establish Equatys, a shared space and ground infrastructure platform, with the two companies to make an initial equity contribution of up to US$1 billion. (US$1 = RM4.06)

Announced at World Space Business Week in Paris, Equatys will support the extension of mobile coverage to areas that terrestrial networks cannot serve, including coverage gaps in populated metropolitan areas.

Viasat, a global leader in satellite and secure communications, is expected to be appointed as Equatys’ prime technology contractor, according to Space42 in a statement.

Space42 and Viasat have commercial relationships with more than 400 mobile operators worldwide and access to over 100 megahertz (MHz) of globally coordinated Mobile Satellite Services (MSS) spectrum for Direct-to-Device (D2D) deployment, creating a scalable foundation for the venture.

Equatys will support the connection of smartphones, Internet of Things (IoT) devices and other devices and terminals directly to satellites, allowing mobile operators to offer voice, text and data where cellular networks are otherwise unavailable or have low density.

The agreement builds on work by Space42 and Viasat on the technical design and manufacture of the satellites, along with progress in terrestrial network integration, interoperability standards and engagement with mobile network operators and other ecosystem participants.

Built on a Tower Company model, which helped the terrestrial mobile industry scale by sharing standardised and common infrastructure among operators, Equatys will provide a neutral, shared layer of satellite and ground infrastructure.

By sharing infrastructure rather than duplicating it, ecosystem participants can reduce capital requirements, accelerate deployment, increase service availability, and maintain customer and commercial independence.

Multiple operators will be able to use the same platform while maintaining their own spectrum licensing rights, customers and commercial relationships. The model is designed to allow additional spectrum licensees and satellite operators to participate as the system scales.

-- BERNAMA

ZEISS UNVEILS HYBRID 3D X-RAY MICROSCOPE FOR MULTI-SCALE IMAGING

KUALA LUMPUR, Sept 15 (Bernama) -- ZEISS, a technology enterprise operating in the fields of optics and optoelectronics, has introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers analyse samples faster.

Combining X-ray microscopy and microCT in a single platform, the system provides multi-scale imaging, guided workflows and automated artificial intelligence (AI)-enabled reconstruction for non-destructive 3D imaging.

In a statement, ZEISS Microscopy Head of the X-ray Microscopy Field of Business, Nicolas Gueninchault said the system enables users to work more efficiently while balancing throughput, resolution and ease of use, adding that it also helps protect valuable samples while providing 3D imaging capabilities.

ZEISS VersaXRM 5 Insight combines large field-of-view and high-resolution imaging in one system, allowing users to inspect larger samples, zoom into regions of interest and capture detailed 3D images without changing hardware configurations or interrupting workflows.

The system combines the throughput, flexibility and efficiency of microCT with the detailed imaging capabilities of laboratory-based X-ray microscopy, enabling a unified workflow for imaging large-scale structures and fine internal features while preserving sample integrity.

ZEISS VersaXRM 5 Insight features Resolution at a Distance (RaaD), which enables high-resolution imaging of small features and internal defects within larger samples. The technology reduces the need to cut, trim or refixture samples, helping users save time, reduce preparation errors and protect delicate or difficult-to-reproduce specimens.

The system also features ZEN navx, an intuitive software environment with intelligent guidance and sample-aware navigation that simplifies setup, supports sample-specific imaging decisions and helps protect samples and the system.

ZEISS VersaXRM 5 Insight supports applications across materials research, industrial inspection and life sciences, including failure analysis, internal defect detection, part quality inspection and 3D visualisation of biological structures across multiple scales.

The system also supports in-situ and 4D studies in materials research, as well as root-cause analysis of semiconductor and electronic packages and yield improvement in manufacturing and quality assurance applications.

-- BERNAMA

Alderbuck Energy Appoints Sunil Chhaya As VP Of Market Development & Applications Engineering

KUALA LUMPUR, Sept 10 (Bernama) -- Alderbuck Energy, a San Diego-based power infrastructure company, has announced the appointment of Sunil Chhaya as Vice President (VP) of Market Development & Applications Engineering.

Joining Alderbuck from the Electric Power Research Institute (EPRI), Chhaya will lead market development and applications engineering for the company’s integrated power platform, the Nexus Power Unit medium-voltage solid-state transformer and the PowerVector AI software layer.

“I joined Alderbuck because it has a team that has previously commercialised advanced hardware, and because the company understands that power electronics and the intelligence layer must be systemised together.

“It is not often a career comes full circle this precisely, and Alderbuck is exactly where I am excited to close that loop,” said Chhaya in a statement.

The appointment comes as Alderbuck moves its platform from design into the field. A planned Nexus Power Unit pilot at the San Diego Supercomputer Center at UC San Diego is meant to show how medium-voltage solid-state conversion can cut footprint, installation time and energy losses for high-density artificial intelligence (AI) loads.

The pilot is funded through a California Energy Commission initiative with San Diego Gas & Electric, EmeraldAI and the Good For Others Foundation, according to Alderbuck.

As power demand grows more intense and dynamic with AI compute, transport electrification and distributed resources, Chhaya will help position Alderbuck as a platform that treats power electronics, grid interoperability and site economics as one system.

As power demand grows more intense and dynamic with AI compute, transport electrification, and distributed resources, Chhaya will help position Alderbuck as the platform that treats power electronics, grid interoperability, and site economics as one system.

-- BERNAMA

COMMAND ALKON TO SHOWCASE CLOUD, AI SOLUTIONS AT REGIONAL EVENTS

KUALA LUMPUR, Sept 10 (Bernama) -- Command Alkon, a software and solutions provider for the heavy building materials industry, will showcase its cloud and artificial intelligence (AI) solutions at two industry conferences in Australia and New Zealand in October.

In a statement, the company said it will participate in the 2026 IQA National Conference on the Gold Coast, Australia, from Oct 6 to 8, followed by the Concrete NZ Conference 2026 in Wellington, New Zealand, from Oct 21 to 23.

Command Alkon Vice President of Marketing, Lori Allen said the events provide an opportunity to demonstrate how production, dispatch and fleet operations can run on a connected platform, while showcasing the potential of Command Intelligence to support decision-making.

At the IQA National Conference, Command Alkon will highlight its Command Cloud platform, including Dispatch & Scale Ticketing for scheduling and ticketing, TrackIt for vehicle management, and Command Intelligence, its agentic AI offering that enables producers to query operational data and automate defined tasks.

Meanwhile, at the Concrete NZ Conference, the company will showcase Command Cloud's capabilities for concrete producers, including Batch for plant operations, Dispatch for sales, scheduling, delivery and billing, TrackIt for fleet management and Command Intelligence for AI-powered operational insights and task execution.

Command Alkon said the two events will bring together industry participants from the quarrying, concrete, building and construction sectors, providing opportunities to demonstrate its latest technology and engage with customers across the region.

-- BERNAMA